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IS 191 : 2007Copper - Designation of Grades

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ASTM B224 · EN 1976 · JIS H 2123
CurrentSpecializedSpecificationMaterials Science · Aluminium and Non-Ferrous Metals
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OverviewValues5InternationalEngineer's NotesTablesFAQ3Related

IS 191:2007 is the Indian Standard (BIS) for copper - designation of grades. This standard specifies the designation and chemical composition of various grades of unwrought copper, including cathode, tough pitch, oxygen-free, and phosphorus deoxidized copper. Engineers and manufacturers use this code to select and specify raw copper purity and impurity limits for electrical, plumbing, and general engineering applications.

Establishes a system for the designation of various grades of copper based on their chemical composition and purity.

Overview

Status
Current
Usage level
Specialized
Domain
Materials Science — Aluminium and Non-Ferrous Metals
Type
Specification
International equivalents
ASTM B224-18 · ASTM International, USAEN 1976:2012 · CEN (European Committee for Standardization), EuropeJIS H 2123:2018 · JSA (Japanese Standards Association), Japan
Typically used with
IS 440IS 1817
Also on InfraLens for IS 191
5Key values4Tables3FAQs
Practical Notes
! For high conductivity electrical applications, Cu-ETP or Cu-OF grades must be explicitly specified to ensure the required minimum impurity levels.
! Oxygen-free copper (Cu-OF) should be specified for applications involving heating in reducing atmospheres to prevent hydrogen embrittlement.
! This 2007 revision amalgamated the previous 10 separate parts (from 1980) into a single comprehensive standard.
Frequently referenced clauses
Cl. 4Designation of GradesCl. 5Chemical CompositionCl. 6Freedom from Defects
Pulled from IS 191:2007. Browse the full clause & table index below in Tables & Referenced Sections.
coppernon-ferrous metalstough pitch copperoxygen-free copper

Engineer's Notes

In Practice — Editorial Commentary
When IS 191 is your governing code

IS 191 (2007) provides Copper — Designation of Grades — the IS code for copper material grading + composition used in electrical conductors, plumbing, roofing, decorative architecture + industrial applications.

Use when: specifying copper for electrical applications (cables, busbars, wire); plumbing (pipes, fittings); building (roofing, gutters); industrial (heat exchangers, condensers).

Copper grades + applications

Copper grade designations (per IS 191):

1. Cu-CATH-1 (Cathode Copper, Grade 1): - Purity: 99.99 % Cu min - For: electrical conductors (premium); high-purity applications - Conductivity: 100 % IACS (International Annealed Copper Standard)

2. Cu-CATH-2 (Cathode Copper, Grade 2): - Purity: 99.95 % Cu min - For: electrical + general applications - Conductivity: 99 % IACS

3. Cu-FRTP / Cu-FRHC (Fire-Refined Tough Pitch): - Purity: 99.85 % Cu min - For: electrical conductors (most common) - Conductivity: 98-100 % IACS - Standard production grade

4. Cu-DLP (Phosphorus Deoxidized, Low Phosphorus): - For: heat exchanger tubes; aerospace - Conductivity: 95-98 % IACS

5. Cu-DHP (Phosphorus Deoxidized, High Phosphorus): - For: brazing + welding applications - Conductivity: 80-90 % IACS

Applications by grade: - High-conductivity (FRHC): transmission cables, busbars, transformers, motors - High-conductivity special (CATH-1): instrumentation, fine wires - DLP/DHP: chemical industry, heat exchangers, oxygen-rich environments - Brass / bronze (alloys): decorative, plumbing, hardware

Physical properties: - Density: 8.96 g/cm³ - Melting point: 1085 °C - Thermal expansion: 17 × 10⁻⁶ /°C - Tensile strength: 200-400 MPa (annealed); higher when work-hardened - Electrical conductivity: 58 MS/m (100 % IACS)

Reference values

Conductivity benchmarks (IACS - International Annealed Copper Standard): - 100 % IACS = 58.0 MS/m at 20 °C - 98 % IACS = 56.8 MS/m (standard FRHC) - 95 % IACS = 55.1 MS/m (DLP)

Chemical composition (per IS 191): - CATH-1: Cu ≥ 99.99 %; Cu + Ag ≥ 99.95 % - FRHC: Cu ≥ 99.85 %; O ≤ 0.04 %; sulphur, selenium controlled - DLP: Cu ≥ 99.85 %; P 0.001-0.04 % - DHP: Cu ≥ 99.85 %; P 0.015-0.040 %

Mechanical properties (annealed): - Tensile strength: 200-260 MPa - Yield strength: 70-105 MPa - Elongation: 35-55 % - Hardness (Vickers): 50-80

Acceptance: - Composition per IS 191 - Conductivity per requirement - Mechanical properties per grade - Surface finish (electrical applications: smooth) - Dimensional tolerance per project specification

Common forms: - Wire / rod: electrical conductors - Sheet / plate: electrical busbars, decorative - Tube: plumbing, heat exchangers - Strip: transformer windings, busbars - Granules / powder: metallurgical applications

Service life: - Indoor electrical: 50+ years - Buried electrical: 30-50 years (with protection) - Outdoor electrical: 30-50 years (with periodic maintenance) - Plumbing: 30-50+ years - Heat exchanger: depends on fluid + temperature; 10-30 years

Companion codes
  • IS 1897 — Copper Tubes for Plumbing.
  • IS 9912 — Copper Sheet + Strip for Roofing.
  • IS 12856 — Copper Wire for Communication Cables.
  • IS 1554 — PVC Insulated Cables (with copper conductors).
  • IS 10810 Part 1 — Copper Conductors for Insulated Cables.
  • IS 10810 Part 2:1984 — Aluminium Conductors (alternative).
  • IS 1024 — Copper Pipes + Tubes.
  • IS 11468 — Brass + Bronze Castings.
  • IS 14160 — Copper Alloys (Brass + Bronze).
  • ASTM B 152 — Standard Specification for Copper Sheet, Strip, Plate, Rolled Bar.
  • ASTM B 187 — Copper Bus Bars + Rods.
  • ASTM B 49 — Copper Rod Drawing Stock for Electrical Use.
  • IEC 60028 — Copper Conductors.
  • ISO 1190 — Copper + Copper Alloy Compositions.
  • Bureau of Indian Standards Metallurgy Manuals.
Common pitfalls

1. Wrong grade for application (low-purity in electrical) → high resistance + losses. 2. Surface oxidation not addressed → conductivity drop at terminations. 3. Mixed alloy connections without bi-metallic isolator → galvanic corrosion. 4. Quality not verified per batch → variable performance. 5. Cost-driven substitution → aluminium where copper specified. 6. Annealed copper used for high-mechanical-stress applications → fatigue failure. 7. No surface protection in outdoor exposure → patina + degradation. 8. Storage in damp / corrosive atmosphere → surface oxidation. 9. Mixed bus bar grades → resistance + heating differential.

Lifecycle

1. Specification per IS 191 + application requirement. 2. Procurement from qualified manufacturer. 3. Quality acceptance (composition + conductivity + mechanical). 4. Installation per relevant code (IS 5613 for cables, IS 1042 plumbing). 5. Service: periodic visual inspection. 6. Long-term: copper has excellent service life with proper installation.

IS 191 is fundamental for India's electrical + plumbing + industrial copper usage.

International Equivalents

Similar International Standards
ASTM B224-18ASTM International, USA
HighCurrent
Standard Classification of Coppers
Provides a classification system for copper grades based on processing, purity, and composition, similar to the designation scope of IS 191.
EN 1976:2012CEN (European Committee for Standardization), Europe
HighCurrent
Copper and copper alloys - Cast unwrought copper products
Specifies designations (e.g., CW004A for Cu-ETP) and chemical compositions for various copper grades, directly mapping to IS 191 grades.
JIS H 2123:2018JSA (Japanese Standards Association), Japan
MediumCurrent
Oxygen-free copper, Tough-pitch copper and Deoxidized copper
Specifies requirements and designations (e.g., C1100 for ETP) for key copper grades, but is a product specification rather than a pure designation standard.
ISO 197-1:1983ISO (International Organization for Standardization), International
LowWithdrawn
Copper and copper alloys — Terms and definitions — Part 1: Materials
Provided terms and definitions for copper materials, but did not establish a comprehensive designation system like IS 191.
Key Differences
≠The designation nomenclature is fundamentally different. IS 191 uses descriptive acronyms (e.g., Cu-ETP, Cu-OFC), whereas ASTM uses the UNS system (e.g., C11000, C10200) and EN uses alphanumeric codes (e.g., CW004A, CW008A).
≠IS 191 is a concise designation standard that references other IS codes for detailed composition. In contrast, standards like EN 1976 often include the complete chemical composition tables for the grades within the same document.
≠The international system, particularly ASTM, segregates classification (ASTM B224) from product specifications (e.g., ASTM B5 for ETP shapes, ASTM B170 for OFC shapes). IS 191 serves as the primary designation document for all grades.
≠Some international standards provide a finer granularity of grades. For example, EN distinguishes between Cu-ETP1 (CW004A) and Cu-ETP2 (CW005A), which might both fall under the general Cu-ETP designation in IS 191.
Key Similarities
≈All standards categorize copper based on the same metallurgical principles: oxygen content and the presence/type of deoxidizers. Core categories like Tough-Pitch, Oxygen-Free, and Deoxidized (Phosphorus) are universally recognized.
≈Despite different naming systems, there is a direct and well-established correlation between the primary grades. For instance, IS Cu-ETP is universally understood to be equivalent to ASTM C11000 and EN CW004A.
≈The primary basis for designation in all systems is the chemical composition, particularly the minimum copper purity and the maximum limits on impurities like oxygen, bismuth, and lead that affect electrical or mechanical properties.
≈All systems define high-purity, high-conductivity grades intended for demanding electrical applications (e.g., IS Cu-OFC, ASTM C10100/C10200, EN CW008A) which are characterized by very low oxygen and impurity levels.
Parameter Comparison
ParameterIS ValueInternationalSource
Designation for Electrolytic Tough Pitch CopperCu-ETPC11000 (UNS)ASTM B224-18
Cu + Ag Content for ETP Grade≥ 99.90%≥ 99.90%EN 1976:2012 (for CW004A)
Designation for Oxygen-Free CopperCu-OFCCW008AEN 1976:2012
Cu Content for OFC Grade≥ 99.95%≥ 99.95%EN 1976:2012 (for CW008A)
Oxygen (O) Content for OFC Grade≤ 0.0010% (10 ppm)≤ 0.0005% (5 ppm) [Note: Some international grades like C10100 are even stricter]ASTM B170-17 (for C10200)
Designation for Deoxidized High Phosphorus CopperCu-DHPC12200 (UNS)ASTM B224-18
Phosphorus (P) Content for DHP Grade0.015 - 0.040%0.015 - 0.040%EN 1976:2012 (for CW024A)
Bismuth (Bi) Max Content for ETP Grade≤ 0.0005%≤ 0.0005%EN 1976:2012 (for CW004A)
⚠ Verify details from original standards before use

Key Values5

Quick Reference Values
Purity of Cu-Cath-1 (Cathode Copper)99.99% Min
Purity of Cu-ETP (Electrolytic Tough Pitch)99.90% Min
Max Oxygen in Cu-OF (Oxygen Free Copper)0.0010%
Max Bismuth in Cu-ETP0.0005%
Max Lead in Cu-ETP0.005%

Tables & Referenced Sections

Key Tables
Table 1 - Chemical Composition of Cathode Copper
Table 2 - Chemical Composition of Tough Pitch Copper
Table 3 - Chemical Composition of Oxygen Free Copper
Table 4 - Chemical Composition of Phosphorus Deoxidized Copper
Key Clauses
Clause 4 - Designation of Grades
Clause 5 - Chemical Composition
Clause 6 - Freedom from Defects

Related Resources on InfraLens

Cross-Referenced Codes
IS 440:2020Flux Cored Solder Wire
→
IS 1817:2016Methods of Test for Coating Thickness on Non-...
→

Frequently Asked Questions3

What does Cu-ETP stand for?+
Electrolytic Tough Pitch Copper, which has a minimum copper purity of 99.90% and is standard for electrical applications.
What is the key difference between tough pitch and oxygen-free copper?+
Oxygen-free copper (Cu-OF) is produced to have a maximum of 0.0010% oxygen to prevent embrittlement when heated, whereas tough pitch copper contains controlled amounts of oxygen.
What purity is required for Copper Cathode Grade 1?+
Cu-Cath-1 requires a minimum copper content of 99.99% as per Table 1.

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